A component coupling system for controllable heat transfer from or to a component which is heated by an external and/or internal heat source and is disposed adjacent to a cooler. The component coupling system includes a carrier plate, on which least one first means for spacing is disposed such that a component disposed on the means for spacing and the carrier plate, together with the means for spacing, form a first cavity. If needed, this cavity can be evacuated, filled with a fluid medium, or have a fluid medium flow through it, whereby the heat transfer or the heat dissipation from the component can be controlled in a simple manner.