Invention Grant
- Patent Title: Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device
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Application No.: US15441716Application Date: 2017-02-24
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Publication No.: US10246605B2Publication Date: 2019-04-02
- Inventor: Tadashi Oomatsu , Hirotaka Kitagawa , Yuichiro Goto
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-173105 20140827
- Main IPC: C09D5/00
- IPC: C09D5/00 ; C09D151/00 ; B32B27/00 ; C09D133/14 ; C09D201/02 ; B29C59/00 ; B29C59/16 ; G03F7/00 ; H01L21/02 ; H01L21/3105 ; C08F290/14 ; C09D151/08 ; G03F7/075 ; G03F7/09 ; C09D7/40 ; C09D5/32 ; C09D7/65 ; B29C59/02 ; B29K33/00

Abstract:
Provided are a resin composition for underlayer film formation with which a variation hardly occurs in the line width distribution after processing due to a small thickness of a residual film after mold pressing, a layered product, a method for forming a pattern, an imprint forming kit, and a process for producing a device.Disclosed is a resin composition for underlayer film formation which is used to form an underlayer film by being applied onto a base material, including a first resin having a radical reactive group in the side chain, a second resin containing at least one selected from a fluorine atom and a silicon atom, and a solvent. The second resin is preferably a resin containing a fluorine atom. The radical reactive group of the first resin is preferably a (meth)acryloyl group.
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