Invention Grant
- Patent Title: Chemical film on substrate and method of forming the same, method of forming paracyclophane containing functional ground with disulfide bond
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Application No.: US15185003Application Date: 2016-06-16
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Publication No.: US10246412B2Publication Date: 2019-04-02
- Inventor: Hsien-Yeh Chen , Zhen-Yu Guan , Chih-Yu Wu
- Applicant: MAY-HWA ENTERPRISE CORPORATION
- Applicant Address: TW Taipei
- Assignee: MAY-HWA ENTERPRISE CORPORATION
- Current Assignee: MAY-HWA ENTERPRISE CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Burris Law, PLLC
- Priority: TW104141604A 20151210
- Main IPC: C07C319/22
- IPC: C07C319/22 ; C07C17/16 ; C07C29/14 ; C07C45/30 ; C07C209/08 ; C09D165/04 ; C07C45/45 ; C07C22/04
Abstract:
The present invention provides a method of forming paracyclyophane containing disulfide functional group. The paracyclophane is prepared by adding 3,3′-dithiodipropionic acid (DPDPA) and N-ethyl-N′-(3-(dimethylamino)propyl)carbodiimide (EDC) into 4-aminomethyl [2,2] paracyclophane. The present invention further provides a chemical film and a method of forming the same. The chemical film contains poly-p-xylylene with disulfide functional group and is formed on a substrate by a chemical vapor deposition process.
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