Invention Grant
- Patent Title: Cutting device and chamfering machine comprising the same
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Application No.: US15463996Application Date: 2017-03-20
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Publication No.: US10245658B2Publication Date: 2019-04-02
- Inventor: YoungTae Kim , YuShik Hong , SeulKi Park , DoWon Yang , YeHoon Im
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2016-0038800 20160331
- Main IPC: B23C3/12
- IPC: B23C3/12 ; B23C5/20

Abstract:
The present invention relates to a cutting device and a chamfering machine comprising the same, and according to one aspect of the present invention, a cutting device for use in a chamfering process of a film laminate is provided, in which the cutting device comprises a rotating wheel having a rotation center; and a cutting bite comprising a main body mounted on the rotating wheel and a cutting tip provided on the main body and provided to perform chamfering of the film laminate by rotating the rotating wheel, wherein the cutting bite is mounted on the rotating wheel such that the central axis of the cutting tip is inclined at a first angle with respect to the tangential direction of a rotation locus of the cutting bite formed by rotating the rotating wheel.
Public/Granted literature
- US20170282260A1 CUTTING DEVICE AND CHAMFERING MACHINE COMPRISING THE SAME Public/Granted day:2017-10-05
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