A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.