Invention Grant
- Patent Title: Light emitting device mounting board block, light emitting device, and method of producing the light emitting device
-
Application No.: US15875346Application Date: 2018-01-19
-
Publication No.: US10243126B2Publication Date: 2019-03-26
- Inventor: Hideaki Tosuke , Hideki Hayashi
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2017-008325 20170120
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/48 ; H01L33/60 ; H01L29/866 ; H01L25/16

Abstract:
A light emitting device mounting board block includes: a lead frame having a plate-shape, the lead frame having a first surface, and a second surface located opposite to the first surface; and a resin molded body located on the first surface of the lead frame, the resin molded body having a recessed portion therein. The resin molded body includes a first lateral wall, a second lateral wall, a third lateral wall and a fourth lateral wall, the first and second lateral walls extending in a length direction, the third and fourth lateral walls extending in a width direction.
Public/Granted literature
Information query
IPC分类: