Invention Grant
- Patent Title: Semiconductor device and electrical device
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Application No.: US15681453Application Date: 2017-08-21
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Publication No.: US10243058B2Publication Date: 2019-03-26
- Inventor: Toshiya Yonehara , Hisashi Saito , Yosuke Kajiwara , Daimotsu Kato , Tatsuo Shimizu , Yasutaka Nishida
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2017-046139 20170310
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/20 ; H01L29/205 ; H01L21/02 ; H01L29/778 ; H01L29/51 ; H01L29/201 ; H01L29/78 ; H01L29/417 ; H01L29/423

Abstract:
According to one embodiment, a semiconductor device includes a first semiconductor layer including a nitride semiconductor, a first electrode separated from the first semiconductor layer in a first direction, and a first insulating film including silicon and oxygen and being provided between the first semiconductor layer and the first electrode. The first insulating film has a first thickness in the first direction. The first insulating film includes a first position, and a distance between the first position and the first semiconductor layer is ½ of the first thickness. A first hydrogen concentration of hydrogen at the first position is 2.5×1019 atoms/cm3 or less.
Public/Granted literature
- US20180261681A1 SEMICONDUCTOR DEVICE AND ELECTRICAL DEVICE Public/Granted day:2018-09-13
Information query
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