Invention Grant
- Patent Title: Semiconductor device with increased source/drain area
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Application No.: US15723898Application Date: 2017-10-03
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Publication No.: US10242983B2Publication Date: 2019-03-26
- Inventor: Kangguo Cheng , Chi-Chun Liu , Peng Xu , Jie Yang
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L29/66 ; H01L29/417 ; H01L21/8234 ; H01L29/06

Abstract:
A semiconductor device includes a semiconductor fin arranged on a substrate, a gate stack arranged over a channel region of the fin, and a spacer arranged adjacent to the gate stack. A source/drain region is arranged in the fin the source/drain region having a cavity that exposes a portion of the semiconductor fin. An insulator layer is arranged over a portion of the fin, and a conductive contact material is arranged in the cavity and over portions of the source/drain region.
Public/Granted literature
- US20180069001A1 SEMICONDUCTOR DEVICE WITH INCREASED SOURCE/DRAIN AREA Public/Granted day:2018-03-08
Information query
IPC分类: