Invention Grant
- Patent Title: Apparatus for direct transfer of semiconductor devices with needle retraction support
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Application No.: US15978092Application Date: 2018-05-12
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Publication No.: US10242971B2Publication Date: 2019-03-26
- Inventor: Andrew Huska , Cody Peterson , Clinton Adams , Sean Kupcow
- Applicant: Rohinni, LLC
- Applicant Address: US ID Coeur d'Alene
- Assignee: Rohinni, LLC
- Current Assignee: Rohinni, LLC
- Current Assignee Address: US ID Coeur d'Alene
- Agency: Lee & Hayes, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/075 ; H01L21/683 ; H01L21/48 ; H01L21/677 ; H01L21/68 ; H01L21/687 ; H01L21/66 ; H01L23/00 ; H01L23/544 ; H01L21/67 ; H01L33/62 ; G02F1/1335 ; H01L23/532
Abstract:
An apparatus, for attaching a semiconductor device die to a circuit substrate, includes an elongated rod to press a holding substrate carrying the semiconductor device die into a position at which the semiconductor device die attaches to the circuit substrate; and a support including a base portion having a hole via which the elongated rod passes when actuated to press the holding substrate.
Public/Granted literature
- US20180261580A1 APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES WITH NEEDLE RETRACTION SUPPORT Public/Granted day:2018-09-13
Information query
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