- Patent Title: Electronic circuit package having high composite shielding effect
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Application No.: US15366219Application Date: 2016-12-01
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Publication No.: US10242954B2Publication Date: 2019-03-26
- Inventor: Kenichi Kawabata
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young Law Firm, P.C.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/29 ; H01L23/31 ; H01L23/498 ; H01L23/552
Abstract:
Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin that covers the surface of the substrate so as to embed the electronic component therein, the magnetic mold resin comprising a composite magnetic material containing a thermosetting resin material and a magnetic filler; and a laminated film including at least a metal film and a magnetic film, the laminated film covering at least an top surface of the magnetic mold resin. The metal film is connected to the power supply pattern, and the magnetic film has a higher effective permeability than that of the magnetic mold resin.
Public/Granted literature
- US20180158782A1 ELECTRONIC CIRCUIT PACKAGE HAVING HIGH COMPOSITE SHIELDING EFFECT Public/Granted day:2018-06-07
Information query
IPC分类:
