An electronic component body includes an internal electrode that is partially extended to a surface of the electronic component body and is connected to an external electrode including a conductive material-containing resin layer including a conductive material and a resin layer and a plated layer covering the conductive material-containing resin layer. The conductive material-containing resin layer includes metal particles as the conductive material, and the plated layer extends from the surface of the conductive material-containing resin layer into the conductive material-containing resin layer such that the plated layer coats at least some of the metal particles.