Invention Grant
- Patent Title: Electronic component mounting device
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Application No.: US14908438Application Date: 2013-07-31
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Publication No.: US10231370B2Publication Date: 2019-03-12
- Inventor: Tetsuo Hayashi , Kuniyasu Nakane , Chikashi Teshima
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2013/070679 WO 20130731
- International Announcement: WO2015/015578 WO 20150205
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K13/08 ; H05K9/00 ; H05K3/30

Abstract:
An electronic component mounting device, including: a board conveyance device which conveys and positions a board on which an electronic component is mounted; a mounting device which positions and mounts the electronic component to a mounting position of the board; a loading device which picks up multiple engaged members (clips), and positions and loads the engaged members to a loading position of the board; and a placing device which picks up a cover component that covers the mounted electronic component and that is provided with an engaging portion at a predetermined position, and positions and places the cover component to a position such that the engaging portion corresponds to the engaged member.
Public/Granted literature
- US20160174425A1 ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD Public/Granted day:2016-06-16
Information query