Invention Grant
- Patent Title: Sound transducer with housing and MEMS structure
-
Application No.: US15581744Application Date: 2017-04-28
-
Publication No.: US10231061B2Publication Date: 2019-03-12
- Inventor: Alfons Dehe , Ulrich Krumbein
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H04R19/00
- IPC: H04R19/00 ; H04R19/04 ; H04R7/04 ; B81B3/00

Abstract:
A sound transducer includes a housing with a sound port and a MEMS structure disposed in an interior space of the housing. The MEMS structure and the sound port are acoustically coupled to each other. The MEMS structure separates a front volume from a back volume of the housing. At least one vent hole of the MEMS structure allows a gas exchange between the front volume and the back volume. The sound port allows a liquid to enter the front volume. Further, the MEMS structure prevents liquid from entering the back volume.
Public/Granted literature
- US20180317021A1 SOUND TRANSDUCER WITH HOUSING AND MEMS STRUCTURE Public/Granted day:2018-11-01
Information query