Invention Grant
- Patent Title: Method of manufacturing light emitting device
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Application No.: US15660965Application Date: 2017-07-27
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Publication No.: US10230032B2Publication Date: 2019-03-12
- Inventor: Ikuko Baike
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2016-148663 20160728
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/48 ; H01L33/00 ; H01L33/50 ; H01L33/62 ; H01L25/075 ; H01L33/56

Abstract:
A method of manufacturing a light emitting device, includes mounting, on a support substrate, an element set that includes a plurality of light emitting elements on an element substrate. A light reflecting member is provided between the element set and the support substrate. The element substrate is removed from the plurality of light emitting elements. The support substrate and the light reflecting member is cut between the plurality of light emitting elements so as to singulate a plurality of light emitting devices.
Public/Granted literature
- US20180033929A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2018-02-01
Information query
IPC分类: