Invention Grant
- Patent Title: Electronic sub-assembly and method for the production of an electronic sub-assembly
-
Application No.: US14772597Application Date: 2014-03-12
-
Publication No.: US10229895B2Publication Date: 2019-03-12
- Inventor: Thomas Gottwald , Alexander Neumann
- Applicant: Schweizer Electronic AG
- Applicant Address: DE Schramberg
- Assignee: SCHWEIZER ELECTRONIC AG
- Current Assignee: SCHWEIZER ELECTRONIC AG
- Current Assignee Address: DE Schramberg
- Agency: Shlesinger, Arkwright & Garvey LLP
- Priority: DE102013102542 20130313
- International Application: PCT/EP2014/000653 WO 20140312
- International Announcement: WO2014/139674 WO 20140918
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/18 ; H05K3/30 ; H01L25/00 ; H01L23/00 ; H01L23/498 ; H01L23/538 ; H01L25/07 ; H01L21/48
Abstract:
An electronic sub-assembly (36) comprising at least one electronic component (14) embedded in a sequence of layers, wherein the electronic component (14) is arranged in a recess of an electrically conductive central layer (16) and directly adjoins a resin layer (12, 20) on each side.
Public/Granted literature
- US20160020194A1 ELECTRONIC SUB-ASSEMBLY AND METHOD FOR THE PRODUCTION OF AN ELECTRONIC SUB-ASSEMBLY Public/Granted day:2016-01-21
Information query
