Invention Grant
- Patent Title: Chip embedding package with solderable electric contact
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Application No.: US15436778Application Date: 2017-02-18
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Publication No.: US10229891B2Publication Date: 2019-03-12
- Inventor: Thorsten Scharf , Steffen Jordan , Wolfgang Schober , Thomas Ziegler
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102016103585 20160229
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/538 ; H01L23/498
Abstract:
A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.
Public/Granted literature
- US20170250152A1 Chip embedding package with solderable electric contact Public/Granted day:2017-08-31
Information query
IPC分类:
