Invention Grant
- Patent Title: Light emitting device package having lead electrode with varying thickness
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Application No.: US14978670Application Date: 2015-12-22
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Publication No.: US10224464B2Publication Date: 2019-03-05
- Inventor: Koji Abe , Yuki Shiota
- Applicant: Nichia Corporation
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2014-263695 20141225
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/31 ; H01L33/00 ; H01L33/48 ; H01L33/56 ; H01L33/62 ; H01L33/50
Abstract:
A package for mounting a light emitting element includes: a first lead electrode having, in a plan view, a first region, a second region surrounding a periphery of the first region having a width of 110 μm or more and a thickness greater than that of the first region, and a third region partially surrounding a periphery of the second region and having a thickness smaller than that of the second region; a second lead electrode spaced apart from the first lead electrode; and a resin molded body fixing a portion of each of the first and second lead electrodes. A portion of each of the first and second lead electrodes and a portion of the resin molded body exposed therebetween form a bottom surface of a recess.
Public/Granted literature
- US20160190399A1 PACKAGE, LIGHT EMITTING DEVICE, AND METHODS OF MANUFACTURING THE PACKAGE AND THE LIGHT EMITTING DEVICE Public/Granted day:2016-06-30
Information query
IPC分类:
