Invention Grant
- Patent Title: Fin field effect transistor fabrication and devices having inverted T-shaped gate
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Application No.: US15488053Application Date: 2017-04-14
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Publication No.: US10224417B2Publication Date: 2019-03-05
- Inventor: Veeraraghavan S. Basker , Zuoguang Liu , Tenko Yamashita , Chun-Chen Yeh
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/40 ; H01L29/49 ; H01L29/66 ; H01L29/78 ; H01L21/265 ; H01L21/311 ; H01L27/088 ; H01L29/417 ; H01L29/423 ; H01L21/3065 ; H01L21/3213 ; H01L21/8234

Abstract:
A method of forming a fin field effect transistor (finFET), including forming a temporary gate structure having a sacrificial gate layer and a dummy gate layer on the sacrificial gate layer, forming a gate spacer layer on each sidewall of the temporary gate structure, forming a source/drain spacer layer on the outward-facing sidewall of each gate spacer layer, removing the dummy gate layer to expose the sacrificial gate layer, removing the sacrificial gate layer to form a plurality of recessed cavities, and forming a gate structure, where the gate structure occupies at least a portion of the plurality of recessed cavities.
Public/Granted literature
- US20170352659A1 FIN FIELD EFFECT TRANSISTOR FABRICATION AND DEVICES HAVING INVERTED T-SHAPED GATE Public/Granted day:2017-12-07
Information query
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