Invention Grant
- Patent Title: Signal via positioning in a multi-layer circuit board using a genetic via placement solver
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Application No.: US15813233Application Date: 2017-11-15
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Publication No.: US10223490B2Publication Date: 2019-03-05
- Inventor: Sungjun Chun , Matteo Cocchini , Michael A. Cracraft
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.
Public/Granted literature
- US20180068048A1 SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD USING A GENETIC VIA PLACEMENT SOLVER Public/Granted day:2018-03-08
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