Invention Grant
- Patent Title: Computer-aided resin behavior analyzer
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Application No.: US15096168Application Date: 2016-04-11
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Publication No.: US10223481B2Publication Date: 2019-03-05
- Inventor: Koji Dan , Masatoshi Kobayashi , Tsuyoshi Baba
- Applicant: Honda Motor Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD
- Current Assignee: HONDA MOTOR CO., LTD
- Current Assignee Address: JP Tokyo
- Agency: Duft & Bornsen, PC
- Priority: JP2015-082183 20150415; JP2015-134616 20150703
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In a computer-aided resin behavior analyzer that analyze behavior of a continuous fiber and long discontinuous fiber incorporated in a resin during molding in a mold under predetermined molding conditions through a simulation program installed on a computer, the simulation program is configured to calculate, when analysis conditions including at least multiple nodes F of the fiber is inputted, a bending rate Af of the fiber with respect to an evaluated length obtained from at least one node Fn among multiple nodes F anticipated under the molding conditions based on the analysis conditions, and to evaluate bending of the fiber based on the bending rate Af with respect to the evaluated length.
Public/Granted literature
- US20160342716A1 COMPUTER-AIDED RESIN BEHAVIOR ANALYZER Public/Granted day:2016-11-24
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