Invention Grant
- Patent Title: Integrated optoelectronic chip and lens array
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Application No.: US15402735Application Date: 2017-01-10
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Publication No.: US10222555B2Publication Date: 2019-03-05
- Inventor: Hidetoshi Numata , Masao Tokunari
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: G02B6/32
- IPC: G02B6/32 ; G02B6/42

Abstract:
An optoelectronic coupling system and methods of forming the same include an optoelectronic chip mounted on a substrate. The optoelectronic chip includes one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface, with a first cut-away portion to accommodate the optoelectronic chip, and an upper surface that has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has comprising one or more upper lenses positioned over respective lower lenses.
Public/Granted literature
- US20180196199A1 INTEGRATED OPTOELECTRONIC CHIP AND LENS ARRAY Public/Granted day:2018-07-12
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