Invention Grant
- Patent Title: Reactive hot melt adhesives with improved adhesion
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Application No.: US15202614Application Date: 2016-07-06
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Publication No.: US10221346B2Publication Date: 2019-03-05
- Inventor: Wu Suen
- Applicant: Henkel IP & Holding GmbH
- Applicant Address: DE Duesseldorf
- Assignee: Henkel IP & Holding GmbH
- Current Assignee: Henkel IP & Holding GmbH
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski
- Main IPC: C09J175/06
- IPC: C09J175/06 ; B32B37/12 ; B32B37/06 ; B32B37/08 ; C08G18/75 ; C08G18/76 ; C08G65/26 ; C08G18/42 ; C08G18/44 ; C08G65/336 ; C08G18/22 ; C08G18/24 ; C08L71/08
Abstract:
The present specification relates to moisture reactive hot melt adhesive compositions comprising a silane reactive plasticizer and the reaction product of (i) a semi-crystalline polyol and (ii) a polyisocyanate and (iii) an aminosilane; the production of such adhesives; and the use of such adhesives.
Public/Granted literature
- US20160333236A1 Reactive Hot Melt Adhesives With Improved Adhesion Public/Granted day:2016-11-17
Information query
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