Invention Grant
- Patent Title: Combined machining apparatus and combined machining method
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Application No.: US14914795Application Date: 2014-05-23
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Publication No.: US10220469B2Publication Date: 2019-03-05
- Inventor: Tsugumaru Yamashita , Yoshihito Fujita , Kiyotaka Nakagawa , Shinnosuke Osafune , Haruhiko Niitani , Yoshikatsu Sato
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-181362 20130902
- International Application: PCT/JP2014/063745 WO 20140523
- International Announcement: WO2015/029515 WO 20150305
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23P23/04 ; F02M61/16 ; B23K37/02 ; B23K26/06 ; B23K26/08 ; B23K26/0622 ; B23K26/382

Abstract:
Provided are a combined machining apparatus and a combined machining method capable of performing machining with higher accuracy and at a high speed. The apparatus has a stage unit; a mechanical machining unit including a mechanical machining head having a tool configured to machine a workpiece; a laser machining unit including a laser machining head configured to emit laser for machining the workpiece; a moving unit; and a control unit that controls the operation of each unit, in which the laser machining head has a laser turning unit that turns laser relative to the workpiece, and a condensing optical system that focuses the laser turned by the laser turning unit, and a position at which the workpiece is irradiated with the laser is rotated by the laser turning unit.
Public/Granted literature
- US20160221118A1 COMBINED MACHINING APPARATUS AND COMBINED MACHINING METHOD Public/Granted day:2016-08-04
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