Invention Grant
- Patent Title: Stackable via package and method
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Application No.: US16042312Application Date: 2018-07-23
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Publication No.: US10206285B1Publication Date: 2019-02-12
- Inventor: Akito Yoshida , Mahmoud Dreiza , Curtis Michael Zwenger
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K3/40 ; H05K3/34 ; H05K3/30 ; H05K1/18 ; H01L23/31 ; H01L23/498 ; H01L23/00 ; H05K3/36 ; H01L21/56
Abstract:
A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A
Information query
