Invention Grant
- Patent Title: Micro-electro-mechanical system microphone with dual backplates
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Application No.: US15141335Application Date: 2016-04-28
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Publication No.: US10206047B2Publication Date: 2019-02-12
- Inventor: Kieran Harney , Adrianus Maria Lafort , Brian Moss , Dion Ivo De Roo
- Applicant: INVENSENSE, INC.
- Applicant Address: US CA San Jose
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA San Jose
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R1/04 ; B81B3/00 ; H04R7/06 ; H04R19/01

Abstract:
Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.
Public/Granted literature
- US20170318395A1 MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE WITH DUAL BACKPLATES Public/Granted day:2017-11-02
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