- Patent Title: Semiconductor image sensing device and manufacturing method thereof
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Application No.: US14583433Application Date: 2014-12-26
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Publication No.: US10204959B2Publication Date: 2019-02-12
- Inventor: Chien-Chang Huang , Li-Ming Sun , Chien Nan Tu , Yi-Ping Pan , Yu-Lung Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A semiconductor device includes a substrate including a front side, a back side opposite to the front side, and a high absorption structure disposed over the back side of the substrate and configured to absorb an electromagnetic radiation in a predetermined wavelength; and a dielectric layer including a high dielectric constant (high k) dielectric material, wherein the dielectric layer is disposed on the high absorption structure.
Public/Granted literature
- US20150287761A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-10-08
Information query
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