Invention Grant
- Patent Title: Integrated circuit package including shielding between adjacent chips
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Application No.: US15949286Application Date: 2018-04-10
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Publication No.: US10204869B2Publication Date: 2019-02-12
- Inventor: Chan-hee Jeong , Soo-jae Park , Young-hoon Kim , In-ku Kang , Hee-yeol Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2016-0122379 20160923
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/552 ; H01L23/498 ; H01L25/065 ; H01L25/18 ; H01L23/00
Abstract:
An integrated circuit package includes at least one first chip mounted in a first region of a mounting surface of a printed circuit board, a molding unit covering the mounting surface and surrounding the at least one first chip, an electromagnetic shielding film covering a surface of the molding unit and surrounding the at least one first chip, and a second chip mounted in a second region of the mounting surface. The second chip is exposed outside the electromagnetic shielding film and is spaced apart from the printed circuit board, with the molding unit being between the second chip and the printed circuit board.
Public/Granted literature
- US20180233458A1 INTEGRATED CIRCUIT PACKAGE Public/Granted day:2018-08-16
Information query
IPC分类:
