Invention Grant
- Patent Title: Thin heated substrate support
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Application No.: US15222689Application Date: 2016-07-28
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Publication No.: US10204805B2Publication Date: 2019-02-12
- Inventor: Imad Yousif , Martin Jeffrey Salinas , Paul B. Reuter , Aniruddha Pal , Jared Ahmad Lee
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H05B3/68
- IPC: H05B3/68 ; H01L21/67 ; H01L21/683 ; H01L21/687 ; H01L21/263 ; H05B3/00 ; H01L21/324
Abstract:
The present disclosure relates to an apparatus for heating and supporting a substrate in a processing chamber. A substrate support assembly includes a heated plate having a substrate supporting surface on a front side and a cantilever arm extending from a backside of the heated plate. The heated plate is configured to support and heat a substrate on the substrate supporting surface. The cantilever arm has a first end attached to the heated plate near a central axis of the heated plate, and a second end extending radially outwards from the central axis.
Public/Granted literature
- US20170040192A1 THIN HEATED SUBSTRATE SUPPORT Public/Granted day:2017-02-09
Information query
