Invention Grant
- Patent Title: Component mounting apparatus
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Application No.: US15027972Application Date: 2014-10-17
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Publication No.: US10201120B2Publication Date: 2019-02-05
- Inventor: Isao Takahira , Tomohiro Inoue , Hiroshi Ikeda , Jun Asai
- Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Applicant Address: JP Shizuoka-ken
- Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee Address: JP Shizuoka-ken
- Agency: Studebaker & Brackett, PC
- Priority: JP2013-215936 20131017
- International Application: PCT/JP2014/077709 WO 20141017
- International Announcement: WO2015/056785 WO 20150423
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04
Abstract:
A component mounting apparatus having a feature in which the component mounting apparatus includes a component mounting unit including a nozzle and a distance detector for optically detecting a distance between a component held by the mounting nozzle and a board, and an illuminated region formed by the distance detector is located in a vicinity of a portion obtained by projecting the mounting nozzle onto the board.
Public/Granted literature
- US20160255754A1 COMPONENT MOUNTING APPARATUS Public/Granted day:2016-09-01
Information query
