- Patent Title: Photo-definable glass with integrated electronics and ground plane
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Application No.: US16116088Application Date: 2018-08-29
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Publication No.: US10201091B2Publication Date: 2019-02-05
- Inventor: Jeb H. Flemming , Jeff A. Bullington , Roger Cook , Kyle McWethy
- Applicant: 3D GLASS SOLUTIONS, INC.
- Applicant Address: US NM Albuquerque
- Assignee: 3D Glass Solutions, Inc.
- Current Assignee: 3D Glass Solutions, Inc.
- Current Assignee Address: US NM Albuquerque
- Agency: Chalker Flores, LLP
- Agent Edwin S. Flores
- Main IPC: H01L23/15
- IPC: H01L23/15 ; H05K3/10 ; H05K3/00 ; H05K1/03 ; H01L23/522 ; H01L23/528 ; H01L23/498
Abstract:
The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors, transmission lines and transformers) in photo definable glass ceramic substrates in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
Public/Granted literature
- US20180368267A1 Photo-Definable Glass with Integrated Electronics and Ground Plane Public/Granted day:2018-12-20
Information query
IPC分类:
