Invention Grant
- Patent Title: Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes
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Application No.: US15331614Application Date: 2016-10-21
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Publication No.: US10199706B2Publication Date: 2019-02-05
- Inventor: Samuel R. Connor , Daniel M. Dreps , Jose A. Hejase , Joseph Kuczynski , Joshua C. Myers , Junyan Tang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H01P3/16
- IPC: H01P3/16 ; H05K1/02 ; H01P3/12

Abstract:
Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
Public/Granted literature
- US20180115042A1 DIELECTRIC-BASED WAVEGUIDING IN A MULTI-LAYER PCB Public/Granted day:2018-04-26
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