Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15983145Application Date: 2018-05-18
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Publication No.: US10199509B2Publication Date: 2019-02-05
- Inventor: Yuta Endo
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2016-169448 20160831
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/8234 ; H01L29/10 ; H01L27/088

Abstract:
A high-performance semiconductor device with high reliability is provided. The semiconductor device includes a first transistor, a second transistor, a first metal oxide covering at least part of the first transistor, an insulating film over the first transistor and the second transistor, and a second metal oxide over the insulating film. The first transistor includes a first gate electrode, a first gate insulating film, a first oxide, a first source electrode, a first drain electrode, a second gate insulating film, and a second gate electrode. The second transistor includes a third gate electrode, a third gate insulating film, a second oxide, a second source electrode, a second drain electrode, a fourth gate insulating film, and a fourth gate electrode. The first gate insulating film and the second gate insulating film are in contact with the first metal oxide.
Public/Granted literature
- US20180269327A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-09-20
Information query
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