Invention Grant
- Patent Title: Compound semiconductor device and method of manufacturing compound semiconductor device
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Application No.: US15716015Application Date: 2017-09-26
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Publication No.: US10199489B2Publication Date: 2019-02-05
- Inventor: Kozo Makiyama
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2016-201427 20161013
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L21/285 ; H01L29/205 ; H01L29/20 ; H01L29/32

Abstract:
A compound semiconductor device disclosed herein includes: a GaN carrier transit layer formed on a substrate; a barrier layer formed on the carrier transit layer; a first recess and a second recess formed in the barrier layer; a first InAlN layer and a second InAlN layer formed in the first recess and the second recess respectively, a composition ratio of In in the InAlN layers being equal to or more than 17% and equal to or less than 18%; a source electrode formed on the first InAlN layer; a drain electrode formed on the second InAlN layer; and a gate electrode formed on the barrier layer.
Public/Granted literature
- US20180108768A1 COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR DEVICE Public/Granted day:2018-04-19
Information query
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