Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
-
Application No.: US15411268Application Date: 2017-01-20
-
Publication No.: US10199484B2Publication Date: 2019-02-05
- Inventor: Nao Nagata
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2015-063339 20150325
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/768 ; H01L23/535 ; H01L27/082 ; H01L29/739 ; H01L29/40 ; H01L29/66 ; H01L29/10 ; H01L29/08 ; H01L29/36 ; H01L29/423

Abstract:
An improvement is achieved in the performance of a semiconductor device. The semiconductor device includes a first trench gate electrode and second and third trench gate electrodes located on both sides of the first trench gate electrode interposed therebetween. In each of a semiconductor layer located between the first and second trench gate electrodes and the semiconductor layer located between the first and third trench gate electrodes, a plurality of p+-type semiconductor regions are formed. The p+-type semiconductor regions are arranged along the extending direction of the first trench gate electrode in plan view to be spaced apart from each other.
Public/Granted literature
- US20170133483A1 Semiconductor Device and Manufacturing Method Thereof Public/Granted day:2017-05-11
Information query
IPC分类: