- Patent Title: Electrical connection structure, array substrate and display device
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Application No.: US15127139Application Date: 2015-12-22
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Publication No.: US10199397B2Publication Date: 2019-02-05
- Inventor: Liping Liu , Wenxiang Yin , Yu Ai , Junqi Han
- Applicant: BOE Technology Group Co., Ltd. , HEFEI Xinsheng Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Beijing CN Hefei
- Assignee: BOE Technology Group Co., Ltd.,Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.,Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing CN Hefei
- Agency: Banner & Witcoff, Ltd.
- Priority: CN201520566486U 20150728
- International Application: PCT/CN2015/098268 WO 20151222
- International Announcement: WO2017/016153 WO 20170202
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G02F1/1345 ; G02F1/1362 ; G02F1/155 ; H05K1/18

Abstract:
An electrical connection structure, an array substrate and a display device. The electrical connection structure includes a first electrical connection component, which includes: a conductive structure; an insulating layer covering the conductive structure, where at least one first via hole and at least one second via hole are disposed separately in the insulating layer, each first via hole and each second via hole expose a respective part of a surface of the conductive structure; and a conductive connection layer disposed on the insulating layer and covering the at least one first via hole and the at least one second via hole, where the conductive connection layer and the conductive structure are electrically connected with each other through the at least one first via hole and the at least one second via hole. The electrical connection structure can reduce undercut phenomena that occur at via holes in the insulating layer.
Public/Granted literature
- US20180175065A1 Electrical Connection Structure, Array Substrate and Display Device Public/Granted day:2018-06-21
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