Invention Grant
- Patent Title: UBM (under bump metal) electrode structure for radiation detector, radiation detector and production method thereof
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Application No.: US15705421Application Date: 2017-09-15
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Publication No.: US10199343B2Publication Date: 2019-02-05
- Inventor: Makoto Mikami , Kouji Murakami , Akira Noda
- Applicant: JX NIPPON MINING & METALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JX NIPPON MINING & METALS CORPORATION
- Current Assignee: JX NIPPON MINING & METALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Hauptman Ham, LLP
- Priority: JP2015-073144 20150331
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; G01T1/24 ; H01L31/00 ; H01L27/144 ; H01L27/146 ; H01L31/08 ; H01L31/10
Abstract:
An UBM electrode structure body for a radiation detector and a radiation detector arranged with the UBM electrode structure body are provided for suppressing peeling and having high electrode adhesion. In addition, a manufacturing method of an UBM electrode structure body for a radiation detector and a manufacturing method of a radiation detector using the UBM electrode structure body are provided in which peeling does not occur during UBM structure formation, a solder bonding process or bonding of a signal line to a Pt layer. The UBM electrode structure body for a radiation detector of the present invention is arranged with a CdTe substrate or CdZnTe substrate and a Pt electrode layer arranged on the CdTe substrate or CdZnTe substrate, adhesion of the Pt electrode layer with respect to the CdTe substrate or the CdZnTe substrate being 0.5 N/cm or more.
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