- Patent Title: Printed circuit board and semiconductor package including the same
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Application No.: US15485794Application Date: 2017-04-12
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Publication No.: US10199319B2Publication Date: 2019-02-05
- Inventor: Jong-Bo Shim , Sang-Uk Han , Yun-Seok Choi , Ji-Hwang Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2016-0100884 20160808
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L25/065

Abstract:
A printed circuit board (PCB) includes a substrate base including at least two chip attach regions spaced apart from one another, a plurality of upper pads disposed in the at least two chip attach regions of the substrate base, an accommodation cavity overlapping a part of each of the at least two chip attach regions and recessed in an upper surface of the substrate base, and at least one spacing groove recessed in the upper surface of the substrate base. The at least one spacing groove is connected to the accommodation cavity, and extends in a region between the at least two chip attach regions.
Public/Granted literature
- US20180040549A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2018-02-08
Information query
IPC分类: