Invention Grant
- Patent Title: Distribution and stabilization of fluid flow for interlayer chip cooling
-
Application No.: US15798527Application Date: 2017-10-31
-
Publication No.: US10199309B2Publication Date: 2019-02-05
- Inventor: Timothy J. Chainer , Pritish R. Parida , Fanghao Yang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/473 ; H01L21/48 ; H01L23/367 ; H01L23/02 ; H01L23/427 ; H01L25/065

Abstract:
A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.
Public/Granted literature
- US20180061739A1 DISTRIBUTION AND STABILIZATION OF FLUID FLOW FOR INTERLAYER CHIP COOLING Public/Granted day:2018-03-01
Information query
IPC分类: