An air-cooling heat dissipation device includes a guiding carrier and a gas pump. The guiding carrier includes a pump-receiving recess, a first guiding chamber, a second guiding chamber, a communication structure and at least one discharge groove. The first guiding chamber is concavely formed in the pump-receiving recess, and is in communication with the first guiding chamber. The communication structure is communicating between the first guiding chamber and the second guiding chamber, while the electronic component is disposed within the second guiding chamber. The gas pump is disposed within the pump-receiving recess. When the gas pump is enabled, an ambient gas is driven to sequentially flow through the first guiding chamber, the communication structure and the second guiding chamber to remove the heat from the electronic component. Since the discharge groove is communicating between the second guiding chamber and exterior surroundings, the heated gas is outputted from the discharge groove.