- Patent Title: Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, chamfer short, and corner short test areas
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Application No.: US15942470Application Date: 2018-03-31
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Publication No.: US10199286B1Publication Date: 2019-02-05
- Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
- Applicant: PDF Solutions, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: PDF Solutions, Inc.
- Current Assignee: PDF Solutions, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent David Garrod
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/66 ; H01L27/118 ; H01L29/417 ; H01L27/02 ; H01L23/528 ; G06F11/07 ; G06F17/50 ; H01L29/06
Abstract:
A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, chamfer short, and corner short test areas.
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