Invention Grant
- Patent Title: Method for manufacturing flexible electrode using sputtering process
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Application No.: US15615855Application Date: 2017-06-07
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Publication No.: US10199226B2Publication Date: 2019-02-05
- Inventor: Chang-Koo Kim , Hae-Min Lee , Chang-Jin Park
- Applicant: Industry-Academic Cooperation Foundation of Ajou University
- Applicant Address: KR Suwon-si
- Assignee: Industry-Academic Corporation Foundation of ajou University
- Current Assignee: Industry-Academic Corporation Foundation of ajou University
- Current Assignee Address: KR Suwon-si
- Agency: Vorys, Sater, Seymour & Pease LLP
- Agent Mih Suhn Koh
- Priority: KR10-2016-0073440 20160613
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/768 ; H01L21/02 ; H01L21/44 ; H01L51/00 ; H01L51/52
Abstract:
There is provided a method for manufacturing a flexible electrode, the method comprising: cleaning a plastic substrate; forming a metal-oxide seed layer on the plastic substrate by sputtering a metal oxide on the plastic substrate; and forming a metal plating layer on the metal oxide seed layer using an electroless plating.
Public/Granted literature
- US20170358454A1 METHOD FOR MANUFACTURING FLEXIBLE ELECTRODE USING SPUTTERING PROCESS Public/Granted day:2017-12-14
Information query
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