Invention Grant
- Patent Title: Tantalum capacitor
-
Application No.: US14668740Application Date: 2015-03-25
-
Publication No.: US10199174B2Publication Date: 2019-02-05
- Inventor: Jae Bum Cho , Hong Kyu Shin , Hyun Sub Oh , Jeong Oh Hong , Hee Sung Choi , Wan Suk Yang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0143624 20141022
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G9/15 ; H01G4/236 ; H01G4/224 ; H01G9/012 ; H01G9/10 ; H01G9/14 ; H01G9/26
Abstract:
There is provided a tantalum capacitor including: a tantalum capacitor body; a plurality of tantalum wires and an adhesive layer on a lower surface of the tantalum capacitor body; and a molding part enclosing the tantalum capacitor body, wherein the tantalum wire and the adhesive layer are connected to an anode lead frame and a cathode lead frame, respectively.
Public/Granted literature
- US20160118189A1 TANTALUM CAPACITOR Public/Granted day:2016-04-28
Information query
