Invention Grant
- Patent Title: Coil component and method of manufacturing the same
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Application No.: US15200700Application Date: 2016-07-01
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Publication No.: US10199154B2Publication Date: 2019-02-05
- Inventor: Seok Il Hong , Jae Yeol Choi , Jong Bong Lim , Ju Hwan Yang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0161637 20151118
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/245 ; H01F27/255 ; H01F27/29 ; H01F41/02 ; H01F41/04 ; H01F41/10 ; H01F1/26 ; H01F17/00 ; H01F17/04

Abstract:
A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.
Public/Granted literature
- US20170140866A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-05-18
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