Invention Grant
- Patent Title: Three-dimensional mask model for photolithography simulation
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Application No.: US15174732Application Date: 2016-06-06
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Publication No.: US10198549B2Publication Date: 2019-02-05
- Inventor: Peng Liu , Yu Cao , Luoqi Chen , Jun Ye
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G03F1/00 ; G03F1/36 ; G03F7/20

Abstract:
A three-dimensional mask model that provides a more realistic approximation of the three-dimensional effects of a photolithography mask with sub-wavelength features than a thin-mask model. In one embodiment, the three-dimensional mask model includes a set of filtering kernels in the spatial domain that are configured to be convolved with thin-mask transmission functions to produce a near-field image. In another embodiment, the three-dimensional mask model includes a set of correction factors in the frequency domain that are configured to be multiplied by the Fourier transform of thin-mask transmission functions to produce a near-field image.
Public/Granted literature
- US20160357900A1 THREE-DIMENSIONAL MASK MODEL FOR PHOTOLITHOGRAPHY SIMULATION Public/Granted day:2016-12-08
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