A lead-free, tin-based solder alloy contains about 0.6 to about 0.8 wt % copper, about 2.8 to about 3.2 wt % silver, about 2.8 to about 3.2 wt % bismuth, about 0.5 to about 0.7 wt % antimony, about 0.04 to about 0.07 wt % nickel, and about 0.007 to about 0.015 wt % titanium, exhibits low melting temperature, narrow solidification range and undercooling, high hardness and ultimate tensile strength at room temperature and high temperature, good formability, superior reliability performance such as creep resistance at high temperature, improved thermal cycle fatigue resistance on leadless (BGA and QFN) surface mount devices, stable microstructure at high temperature, very good solderability performance, low voiding in bottom terminated components, and mitigated tin whisker growth as compared with other lead-free solder alloys