Invention Grant
- Patent Title: Copper foil composite, copper foil used for the same, formed product and method of producing the same
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Application No.: US14115803Application Date: 2012-05-08
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Publication No.: US10178816B2Publication Date: 2019-01-08
- Inventor: Kazuki Kammuri
- Applicant: Kazuki Kammuri
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Priority: JP2011-108298 20110513
- International Application: PCT/JP2012/061761 WO 20120508
- International Announcement: WO2012/157469 WO 20121122
- Main IPC: B32B15/01
- IPC: B32B15/01 ; H05K1/09 ; B21D33/00 ; C22F1/08 ; C22C9/00 ; B32B15/20 ; B32B15/08 ; H05K9/00 ; C22C9/02 ; C22C9/04 ; B32B27/28 ; B32B27/32 ; B32B7/12 ; B32B27/00
Abstract:
A copper foil composite comprising a copper foil and a resin layer laminated, the copper foil containing at least one selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag at a total of 30 to 500 mass ppm, a tensile strength of the copper foil having of 100 to 180 MPa, a degree of aggregation I200/I0200 of a (100) plane of the copper foil being 30 or more, and an average grain size viewed from a plate surface of the copper foil being 10 to 400 μm.
Public/Granted literature
- US20140162084A1 COPPER FOIL COMPOSITE, COPPER FOIL USED FOR THE SAME, FORMED PRODUCT AND METHOD OF PRODUCING THE SAME Public/Granted day:2014-06-12
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