An electronics module includes a housing, a connector, and a baseplate. The housing and connector are attached to each other and mounted to the baseplate. The housing includes a protrusion that is received between an inner flange and an outer flange of the connector. The housing and connector combine to define a sealing plane that extends to co-planar bottom surfaces of the housing and connector. The housing and connector, when assembled, define a water intrusion path between an outer protrusion of the housing and the outer flange of the connector. The water intrusion path includes a plurality of chicanes that reduces the pressure of water that enters the path. The bottom surface of the housing defines a recessed channel to receive water.