Invention Grant
- Patent Title: Differential signal line wiring method and PCB board
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Application No.: US15529183Application Date: 2015-05-13
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Publication No.: US10178776B2Publication Date: 2019-01-08
- Inventor: Tao Guo , Fengchao Ma , Yuanwang Zhang
- Applicant: ZTE CORPORATION
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: ZTE CORPORATION
- Current Assignee: ZTE CORPORATION
- Current Assignee Address: CN Shenzhen, Guangdong
- Agency: Scully Scott Murphy & Presser
- Priority: CN201410708381 20141128
- International Application: PCT/CN2015/078903 WO 20150513
- International Announcement: WO2016/082480 WO 20160602
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/10 ; H05K1/03

Abstract:
A method for wiring differential signal lines and a PCB are disclosed. The wiring method includes: providing a rectangle-shaped glass fiber fabric formed of glass fibers which are woven and interlaced with each other and an adhesive filled therebetween; determining a wiring direction and obtaining a glass fiber bundle number of the glass fiber fabric in the wiring direction; equally dividing the glass fiber fabric into glass fiber units, and obtaining a width of each glass fiber unit according to a size of the glass fiber fabric in a direction perpendicular to the wiring direction and the number of the glass fiber units; determining a line distance and line widths of the differential signal lines; and according to the line distance and the line widths, forming the differential signal lines on a metal layer along the wiring direction to make the differential signal lines meet predetermined requirements.
Public/Granted literature
- US20170325334A1 DIFFERENTIAL SIGNAL LINE WIRING METHOD AND PCB BOARD Public/Granted day:2017-11-09
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