- Patent Title: Circuit board, manufacturing method thereof and display apparatus
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Application No.: US14894953Application Date: 2015-07-20
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Publication No.: US10178771B2Publication Date: 2019-01-08
- Inventor: Defeng Mao , Yanbing Wu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201410853467 20141231
- International Application: PCT/CN2015/084436 WO 20150720
- International Announcement: WO2016/107143 WO 20160707
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H05K3/30 ; G02F1/1345 ; H05K3/34

Abstract:
The embodiments of present invention disclose a circuit board and a manufacturing method thereof and a display apparatus comprising the circuit board. The circuit board comprises a base substrate, a device to be soldered, a bonding pad and a support, wherein the bonding pad and the support are provided on the base substrate, and the device to be soldered is provided on the support and is connected with the bonding pad. By providing the device to be soldered on the support, the embodiments of present invention can effectively prevent the short circuit of the device to be soldered during the process of soldering and thus improve product yield.
Public/Granted literature
- US20160345436A1 CIRCUIT BOARD, MANUFACTURING METHOD THEREOF AND DISPLAY APPARATUS Public/Granted day:2016-11-24
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