An interconnection and insulation module is provided that is arranged to locate about a plurality of busbar pairs. Each busbar pair includes first and second busbars with an inter-busbar gap in between. The module includes opposed sides which accommodate the busbar pairs between them. Corresponding windows are formed through the opposed sides of the module and busbar separators extend from interior surfaces of the opposed sides. The bus bar separators locate inter-busbar gaps for each busbar pair between one or more of the corresponding windows. Passages are defined between the corresponding windows of the opposed sides via the inter-busbar gaps for insertion of an electrical interconnection member. In use busbars can be readily interconnected by aligning their respective modules against each other and applying electrical interconnection members through the windows.